• Chinmay
• November 25, 2024
• Industrial IoT, Internet of Things, News
• advanced packaging, amd, chiplet technology, chiplets, Digital Transformation, IIoT, intel, IoT, modular design, Moore's Law, semiconductor design, thermal management
• 0 Comments

In the dynamic world of semiconductors, chiplet technology has emerged as a game-changer, addressing challenges faced by traditional monolithic System-on-Chip (SoC) designs. As Moore’s Law decelerates, the semiconductor industry is exploring innovative paths to boost performance and functionality without solely relying on transistor density. The concept of chiplets, highlighted in the IDTechEx report “Chiplet Technology 2025-2035: Technology, Opportunities, Applications,” offers …