A Decade of Make in India: Driving Unprecedented Growth and Opportunities in Electronics Manufacturing
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Chinmay
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December 19, 2024
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Electronics, India, Industrial IoT, Internet of Things, News
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Electronics Exports, Electronics Manufacturing, Embedded Systems, EMS sector, India manufacturing growth, Industry 4.0, IoT in manufacturing, make in india, PLI Scheme, smart factories
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India’s Make in India initiative, celebrating a decade of impact, has proven to be a game-changer for the country’s electronics manufacturing sector. From the meteoric rise of the Electronics Manufacturing Services (EMS) industry to the integration of IoT and embedded electronics, India has emerged as a global manufacturing powerhouse. EMS Sector: A Growth Catalyst The EMS sector has witnessed unparalleled …
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Valeo and ROHM Semiconductor Co-Develop Next-Generation Power Electronics for Electric Vehicles
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Chinmay
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November 27, 2024
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Automotive, Electronics, News
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decarbonization, Electric Vehicles, electrified mobility, EV powertrain, high voltage inverters, motor inverters, power electronics, ROHM Semiconductor, SiC technology, TRCDRIVE pack, Valeo
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Valeo, a global leader in automotive technology, and ROHM Semiconductor, a prominent player in the semiconductor industry, have joined forces to develop advanced power modules for electric motor inverters. This collaboration marks a significant milestone in advancing electrified mobility solutions, combining Valeo’s expertise in mechatronics, thermal management, and software development with ROHM’s cutting-edge Silicon Carbide (SiC) technology. Powering the Future …
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Hexagon Manufacturing Intelligence India Partners with SimYog to Revolutionize EMI/EMC Testing in Electronics Design
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Chinmay
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November 18, 2024
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Electronics, News
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agile hardware design, automotive industry, Compliance-Scope, digital reality, Electronics Manufacturing, EMC testing, EMI compliance, hardware design, Hexagon Manufacturing Intelligence, SimYog
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Hexagon Manufacturing Intelligence India Pvt. Ltd., a subsidiary of Hexagon, the global leader in digital reality solutions, has announced a strategic business partnership with Bangalore-based SimYog Technology Pvt. Ltd. This collaboration aims to bring SimYog’s cutting-edge Electromagnetic Interference (EMI) and Electromagnetic Compatibility (EMC) simulation solutions to customers across India, addressing critical compliance challenges in the electronics and automotive industries. Tackling …
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Qualcomm Unveils the World’s Most Advanced 5G Modem-RF System, Harnessing Integrated AI to Enable the Next Generation of 5G
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Hrishikesh
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March 6, 2024
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Artificial Intelligence, Electronics, News
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5G Advanced, 5G Innovation, 5G Modem-RF System, Artificial Intelligence, Carrier Aggregation, Cloud-Edge Convergence, connectivity, Digital Economy, Intelligent Connectivity, IoT devices, Qualcomm, Satellite Communications, Snapdragon X80, Spectrum Efficiency, Wireless Communication
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With the release of the Snapdragon® X80 5G Modem-RF System, Qualcomm Technologies, Inc. has demonstrated its continued leadership in 5G innovation. Representing the seventh iteration of its 5G modem-to-antenna system, the Snapdragon X80 is set to revolutionize connectivity in a range of product categories, including smartphones and IoT devices for cars and industries. The groundbreaking features and potential influence on …
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Infineon : New Chip Factory for thin wafer power electronics
Opening comes amid sustained high demand for microelectronics Infineon strengthens global supply security for power electronics with investment of 1.6 billion euros Energy-saving chips are a key lever for achieving climate targets European high-tech manufacturing: Infineon sites in Villach and Dresden form a virtual mega-factory Munich, Germany, and Villach, Austria, 17 September 2021 – Infineon Technologies AG today officially opened …
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Toshiba and Nordic Semi team-up to launch the World’s Smallest BLE Module
Nordic Semiconductor today announces that Tokyo, Japan-based multinational conglomerate, Toshiba Corporation, has selected the 2.48 by 2.46mm wafer level chip scale package (WLCSP) version of Nordic’s nRF52811 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the core processing power and wireless connectivity for its ‘Bluetooth module with SASP Technology’. The module with integrated antenna comes in a miniaturized 4 …
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Ultra-low current consumption linear battery charger
The STBC15 is a linear charger thin film battery with a maximum charging current of 40 mA. The device uses a CC/CV algorithm to charge the battery. Thanks to the ultra-low consumption architecture, the charger is suitable for low-capacity cells such as thin film batteries and can use low energy sources such as energy harvesters. A 5 V input like …
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New KYOCERA Ceramic RFID Package With Embedded Antenna Increases Read Range Up To 2X
IoT innovation accelerates expansion of RFID applications in automotive, mHealth, many other markets May 2, 2017: Kyocera Corporation (President: Hideo Tanimoto) announced that it has developed an ultra-small ceramic package utilizing a proprietary multilayer structure with a built-in RFID*1antenna that can increase the read range up to 2X as compared with conventional packages of the same size. Starting mass production …
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USB Type-C: Enabling adoption of new standard for electronics
The days of carrying around multiple chargers and accessories for your smartphone, laptop and other electronic devices may be coming to an end, thanks to the next-generation universal serial bus called USB Type-C. Imagine charging all of your electronics with a single cable, powering your laptop battery as you drive to that next meeting, and simply plugging your notebook into …
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Inter-Integrated Circuit (I2C)
History During the 1980s, Philips developed the two wire inter-integrated circuit (I2C ) bus to provide an easy way to connect peripherals to a central processing unit (CPU/ MCU) in TV applications. As the circuit became more and more complex with the number of peripherals connections increasing, a method was needed to simplify the design and reduce costs. By limiting …
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