• Hrishikesh
• May 25, 2023
• Development
• advanced packaging, bandwidth, chiplet interconnect, compute intensive, Eliyan, NuLink PHY, power and area, silicon availability, TSMC 5nm
• 0 Comments

Eliyan, a developer known for its high-performing and efficient chiplet interconnect technology, has announced a significant milestone with the availability of its NuLink PHY technology in silicon. This achievement comes just one year after the company received its initial funding and serves as validation for Eliyan’s UCIe-compatible approach to enabling high-performance and scalable multi-die architectures for compute-intensive applications. Implemented using …