Chiplets: Transforming Semiconductor Design for the IoT and IIoT Era

• Chinmay
• November 25, 2024
• Industrial IoT, Internet of Things, News
• advanced packaging, amd, chiplet technology, chiplets, Digital Transformation, IIoT, intel, IoT, modular design, Moore's Law, semiconductor design, thermal management
• 0 Comments

In the dynamic world of semiconductors, chiplet technology has emerged as a game-changer, addressing challenges faced by traditional monolithic System-on-Chip (SoC) designs. As Moore’s Law decelerates, the semiconductor industry is exploring innovative paths to boost performance and functionality without solely relying on transistor density. The concept of chiplets, highlighted in the IDTechEx report “Chiplet Technology 2025-2035: Technology, Opportunities, Applications,” offers a modular, efficient, and scalable solution to these challenges, opening new horizons for IoT and IIoT applications.

What Are Chiplets?

Chiplets are discrete, modular semiconductor components designed to work in unison within a larger system. Unlike conventional SoCs, where all functions are integrated onto a single silicon die, chiplets are developed and tested individually before integration. This modular approach provides the flexibility to combine different functionalities while optimizing manufacturing efficiency. Companies like AMD and Intel have already embraced this innovation with products like AMD’s EPYC processors and Intel’s Ponte Vecchio GPU.

Why Chiplets Are Gaining Traction

The slowdown of Moore’s Law has shifted the focus from increasing transistor density to enhancing system-level function density. Chiplets excel in this domain, overcoming traditional constraints such as reticle size and the memory wall. By breaking down chip functions into modular components, manufacturers can achieve:

• Improved Yield: Individual chiplets can be tested separately, reducing defects and increasing manufacturing efficiency.
• Cost Savings: Optimized material use and higher yield reduce production costs.
• Flexibility: The modular design allows for the integration of diverse functionalities tailored to specific IoT and IIoT applications.
• Supply Chain Resilience: Sourcing chiplets from multiple suppliers reduces dependency on single regions, mitigating geopolitical and trade risks.

Key Applications in IoT and IIoT

Chiplets are particularly suited for IoT and IIoT ecosystems where customization, performance, and scalability are paramount. They enable:

• High-Performance Computing for Data Centers: Modular designs cater to increasing data demands with faster processing capabilities.
• AI and Edge Computing: Chiplets facilitate low-latency processing at the edge, critical for real-time IoT operations.
• Smart Devices: The flexibility of chiplets supports innovative designs for consumer IoT devices.
• Industrial Automation: Chiplets integrate seamlessly into IIoT systems, enhancing efficiency and reliability.

Challenges and Opportunities

While chiplets offer significant advantages, they also present new challenges, such as:

• Interconnection Standards: Ensuring seamless communication between chiplets requires advanced interconnect technologies.
• Thermal Management: Increased function density can lead to overheating, necessitating innovative cooling solutions.
• Material Innovation: Developing materials that provide mechanical support, thermal stability, and protection for interconnects is crucial for reliability.

These challenges open opportunities for material suppliers, design tool providers, and other players in the semiconductor ecosystem.

The Road Ahead

The global chiplet market is expected to grow exponentially, reaching $411 billion by 2035. As the semiconductor industry embraces this transformative technology, its impact on IoT and IIoT sectors will be profound, enabling smarter, faster, and more efficient systems.