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Toshiba and Nordic Semi team-up to launch the World’s Smallest BLE Module

Nordic Semiconductor today announces that Tokyo, Japan-based multinational conglomerate, Toshiba Corporation, has selected the 2.48 by 2.46mm wafer level chip scale package (WLCSP) version of Nordic’s nRF52811 Bluetooth Low Energy (Bluetooth LE) System-on-Chip (SoC) to provide the core processing power and wireless connectivity for its ‘Bluetooth module with SASP Technology’. The module with integrated antenna comes in a miniaturized 4 …

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