Nordic Semiconductor and Kigen Announce Collaboration to Accelerate Massive IoT Deployments with eSIM Solutions
- Chinmay
- December 18, 2024
- Internet of Things, News, Semiconductor Industry
- cellular IoT, eSIM management, industrial IoT, IoT prototyping, Kigen eSIM, low-power IoT, Massive IoT, Nordic Semiconductor, Smart Metering, Thingy:91 X
- 0 Comments
Nordic Semiconductor, a leader in low-power wireless solutions, has partnered with Kigen, an innovator in eSIM security for IoT, to fast-track the deployment of Massive IoT solutions. This collaboration combines Kigen’s eSIM IoT Remote Manager (eIM) and eSIM technology with Nordic’s nRF9151 System-in-Package (SiP) to deliver robust, scalable, and low-power cellular IoT solutions.
The partnership highlights a shared commitment to simplifying wireless connectivity for IoT applications, enabling businesses of all sizes to overcome technical barriers and achieve rapid scalability.
Key Highlights of the Collaboration:
- Simplified eSIM Profile Management: Kigen’s eIM platform, built on the GSMA’s SGP.32 standard, streamlines remote eSIM provisioning for low-power IoT devices, making profile management more accessible for SMEs.
- Cutting-Edge IoT Prototyping: Nordic’s Thingy:91 X IoT platform, integrated with Kigen’s eSIM, facilitates testing and development for cellular IoT applications, supporting LTE-M, NB-IoT, GNSS, Bluetooth® LE, and Wi-Fi.
- Compact and Efficient Design: The nRF9151 SiP offers a 20% smaller form factor, 45% reduced peak power usage, and extended battery life compared to earlier models, ideal for low-power IoT devices.
Transforming the Cellular IoT Landscape:
The collaboration represents a significant milestone in advancing cellular IoT solutions. By combining Kigen’s market-leading eSIM capabilities with Nordic’s low-power, compact, and highly integrated SiPs, the partnership is poised to revolutionize industries like smart metering, industrial automation, and asset tracking.
Accelerating IoT Development:
The Nordic Thingy:91 X IoT platform, paired with Kigen’s eIM solution, provides developers with a complete toolkit for eSIM profile management and rapid prototyping. This ensures faster development cycles, reduced complexity, and enhanced scalability for IoT applications.
Key Features and Benefits:
- Scalability: Kigen’s eIM solution supports any network or technology, making it broadly applicable across Massive IoT deployments.
- Battery Efficiency: The nRF9151 SiP reduces power consumption, prolonging device life and enabling long-term IoT deployments.
- Ease of Use: The Thingy:91 X platform offers an all-in-one solution for testing, prototyping, and development, simplifying the IoT journey for businesses.
Commercial Availability in 2025:
The Kigen eIM solution, along with Nordic’s nRF9151 SiP, is available for trials now, with commercial deployment expected in early 2025.
This collaboration between Nordic Semiconductor and Kigen underscores the growing importance of robust and accessible IoT solutions to drive Massive IoT adoption. With industry-leading innovations in connectivity, security, and low-power designs, this partnership sets a strong foundation for the future of IoT.