Valeo and ROHM Semiconductor Co-Develop Next-Generation Power Electronics for Electric Vehicles
- Chinmay
- November 27, 2024
- Automotive, Electronics, News
- decarbonization, Electric Vehicles, electrified mobility, EV powertrain, high voltage inverters, motor inverters, power electronics, ROHM Semiconductor, SiC technology, TRCDRIVE pack, Valeo
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Valeo, a global leader in automotive technology, and ROHM Semiconductor, a prominent player in the semiconductor industry, have joined forces to develop advanced power modules for electric motor inverters. This collaboration marks a significant milestone in advancing electrified mobility solutions, combining Valeo’s expertise in mechatronics, thermal management, and software development with ROHM’s cutting-edge Silicon Carbide (SiC) technology.
Powering the Future of Electric Mobility
As a first step, ROHM will supply its innovative 2-in-1 SiC molded module, the TRCDRIVE pack™, to Valeo. This module will be a critical component in Valeo’s next-generation powertrain solutions, designed to meet the needs of electric vehicles (EVs) and plug-in hybrid vehicles (PHEVs). The partnership aims to optimize cost-performance ratios, boost energy efficiency, and enhance reliability through advanced SiC packaging and mechatronic integration.
Valeo is expanding its reach across all vehicle types, from e-bikes to passenger cars and e-trucks, by focusing on efficient, electrified mobility. This collaboration ensures that the systems driving these vehicles are not only high-performing but also contribute to decarbonizing automotive technologies globally.
A Partnership Rooted in Innovation
The Valeo-ROHM partnership, which began in 2022, initially focused on refining motor inverters—a crucial element in EV propulsion systems. By leveraging Valeo’s component technology and ROHM’s high-power-density SiC modules, both companies have made strides in reducing heat generation, improving cooling systems, and enhancing overall powertrain efficiency.
Xavier Dupont, CEO of Valeo Power Division, emphasized the significance of this collaboration, stating, “This partnership marks a significant step forward in delivering advanced and highly efficient power electronics. Together, we aim to set new industry standards for high-voltage inverters and accelerate the transition towards more efficient and affordable electric mobility.”
Wolfram Harnack, President of ROHM Semiconductor GmbH, added, “ROHM’s TRCDRIVE pack™ provides high power density, leading to improved power efficiency. Together with Valeo, we are fostering innovation in power electronics to support the development of efficient powertrains for EVs.”
TRCDRIVE Pack: A Game-Changer in Power Electronics
The TRCDRIVE pack is a SiC molded module specifically designed for traction inverter drives. It offers:
- High Power Density: Enables compact designs for downsized inverters.
- Low-Loss Conversion: Delivers superior efficiency under high-voltage conditions.
- Unique Terminal Configuration: Addresses challenges in miniaturization and efficiency.
By integrating this technology with Valeo’s advanced thermal management and casing design, the collaboration is set to redefine the industry’s standards for powertrain solutions.
Towards a Decarbonized Future
Valeo plans to launch its first series project in early 2026, setting the stage for a new era of efficient, high-performance xEV inverters. These innovations are vital for meeting the growing demand for longer-range EVs with faster charging capabilities and enhanced affordability.
This collaboration underscores the commitment of Valeo and ROHM to advancing automotive power electronics, contributing significantly to the transition towards a decarbonized society.
