ST Unveils First STM32-Ready Wireless IoT Modules in Collaboration with Qualcomm

• Chinmay
• December 23, 2024
• Internet of Things, New Product Release, News
• AI development, Bluetooth 5.3, edge ai, IoT modules, Matter protocol, Qualcomm, stm32, STMicroelectronics, Thread protocol, Wi-Fi 6, wireless IoT
• 0 Comments

STMicroelectronics has launched the ST67W611M1, the first module stemming from its collaboration with Qualcomm Technologies, aimed at simplifying the development of next-generation wireless IoT solutions for industrial and consumer applications.

This innovative module integrates Qualcomm’s QCC743 multiprotocol connectivity SoC, enabling Wi-Fi 6, Bluetooth 5.3, and Thread capabilities. Seamlessly compatible with the extensive STM32 ecosystem, the module ensures developers can easily integrate it with any STM32 microcontroller (MCU) or microprocessor (MPU).

The ST67W611M1 is pre-certified and self-contained, requiring no RF design expertise, and supports the Matter protocol, offering future-proof connectivity for a variety of IoT applications. It includes features like:

• 4MB Flash for code and data storage.
• 40MHz crystal for efficient system integration.
• An integrated PCB antenna or micro RF (uFL) connector for external antenna options.

Advantages of the ST67W611M1 Module

The ST67W611M1 leverages both Qualcomm’s wireless connectivity expertise and the comprehensive STM32 development ecosystem. Its highlights include:

• Enhanced Security: Hardware cryptographic accelerators, secure boot, and secure debug, certified to PSA Certified Level 1 protection.
• Optimized PCB Design: Compact 32-lead LGA package, allowing simple, cost-effective two-layer PCB designs.
• AI Capabilities: Boosted by the STM32Cube.AI tools and ST Edge AI Suite for advanced edge AI applications.

A Seamless Developer Experience

This module integrates into the STM32 ecosystem, offering developers access to over 4,000 STM32 part numbers and powerful tools like STM32Cube and NanoEdge AI. The module is designed to be compatible with a wide range of STM32 MCUs, from cost-efficient Cortex-M0+ cores to high-performance Cortex-M4 and Cortex-A7 in STM32MP1/2 MPUs.

Future Impact

Scheduled for OEM availability in Q1 2025 and broader release in Q2 2025, the ST67W611M1 marks the beginning of a long-term collaboration between ST and Qualcomm. This partnership aims to deliver cutting-edge solutions in wireless IoT connectivity, AI, 5G, and more.

“This collaboration delivers multiple advantages for the STM32 community,” said Remi El-Ouazzane, President, MDRF Products Group, STMicroelectronics. “Qualcomm’s expertise in widely used wireless technologies is now at developers’ fingertips, combining with the powerful STM32 ecosystem.”

Rahul Patel, General Manager at Qualcomm Technologies, added, “This is just the start of our mission to enable new edge processing applications. We look forward to continued collaboration to deliver unparalleled connected experiences.”

As STMicroelectronics and Qualcomm merge their strengths, the ST67W611M1 is set to drive innovation, making it easier for developers to create robust, future-ready IoT solutions.